12 months contract (NIGHT SHIFT)
Onsite - Hillsboro, OR
Pay: 25/hr - 28.5/hr (DOE)
Responsibilities:
- Perform technical tests and experiments for Process Engineering, including setup and operation of metrology and supporting tools.
- Prepare records, charts, and graphs of test results.
- Operate metrology tools (including TEM, Dual Beam, light microscopes, and sputtering tools) to qualify process equipment and optimize processes.
- Adjust hardware/software parameters to correct issues or execute experiments.
- Work closely with cross-functional engineering teams to troubleshoot process problems.
- Perform minor electrical or mechanical troubleshooting on equipment.
- Perform preventative and unscheduled maintenance on process equipment.
- Operate Dual Beam (SEM and FIB), TEM, light microscopes, deposition equipment, and metrology tools.
- Change/adjust software parameters for differing experiments.
- Work closely with engineering teams.
- Assist in making process related diagrams/graphs.
- Write procedures and training materials.
Requirements:
- Prefer 3-4 years of semiconductor processing experience in thin film deposition, or etch, in a high-volume manufacturing facility but not required.
- Skilled in the use of Microsoft Office applications (Outlook, Access, Word, Excel, and PowerPoint).
- Excellent communication and problem-solving skills.
- Self-starting individual with strong technical and hands-on skills.
- HS diploma, AA/AS, BS/BA, MS/MBA
- Knowledge of EDS, EELS, PEELS, and STEM are highly desirable.
- Physical Requirements:
- Mechanical aptitude, manual dexterity, prolonged sitting, and ability to lift/carry objects up to 35 pounds are required.
- This position requires the use of Personal Protection Equipment and the proper use industry safety procedures while working.
- Occasional travel to training facility and customer location may be required.